CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its range-wide compatibility and readiness for Intel's new 14th Generation Intel Core processors. With a enormous range of tested and validated components such as DDR5 memory, all-in-one liquid CPU coolers, innovative and reliable power supplies, and blazing fast M.2 SSDs, you can be confident that CORSAIR components will pair exceptionally with the latest in Intel processors to help your PC reach its full potential.

The latest Core processors utilize Intel's new Performance Hybrid Architecture, featuring more efficiency-cores for the best gaming experience—even while streaming and encoding video. Other features, such as Intel Thread Director to keep background tasks from slowing down games and Smart Cache for smoother gameplay and faster load times, make 14th Gen Core processors a great choice for PC gaming. But it's not enough to just have the CPU; you need to complete your system with components that can keep up and tap into its full potential, and that's where CORSAIR comes in.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, is ready to usher in the era of Intel Core 14th gen processors with a complete lineup of Z790/Z690 series motherboards. Especially, From the flagship Z790 AORUS XTREME X to the versatile Z790 AORUS ELITE X, the X Gen series is engineered to optimize the performance of Intel Core 14th gen processors and drive DDR5 memory faster than ever.

The AORUS Z790 X Gen motherboards, equipped with cutting-edge technologies, deliver best-in-class DDR5 compatibility and leading performance, supporting up to DDR5 XMP-8266 and beyond. The most crucial technology for DDR5's leading performance is the newly introduced Back Drilling Technology, which enhances signal integrity, resulting in improved system performance and heightened reliability.

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

TrendForce reports indicate a universal price increase for both DRAM and NAND Flash starting in the fourth quarter. DRAM prices, for instance, are projected to see a quarterly surge of about 3-8%. Whether this upward momentum can be sustained will hinge on the suppliers' steadfastness in maintaining production cuts and the degree of resurgence in actual demand, with the general-purpose server market being a critical determinant.

PC DRAM: DDR5 prices, having already surged in the third quarter, are expected to maintain their upward trajectory, fueled by the stocking of new CPU models. This forthcoming price hike cycle for both DDR4 and DDR5 is incentivizing PC OEMs to proceed with purchases. Although manufacturers still have substantial inventory and there's no imminent shortage, Samsung has been nudged to further slash its production. However, facing negative gross margins on DRAM products, most manufacturers are resistant to further price reductions, instead pushing for aggressive increases. This stance sets the stage for an anticipated rise in DDR4 prices by 0-5% and DDR5 prices by around 3-8% in the fourth quarter. Overall, as DDR5 adoption accelerates, an approximate 3-8% quarterly increase is projected for PC DRAM contract prices during this period.

Ever since the creation of A64FX for the Fugaku supercomputer, Fujitsu has been plotting the development of next-generation CPU design for accelerating AI and general-purpose HPC workloads in the data center. Codenamed Monaka, the CPU is the latest creation for TSMC's 2 nm semiconductor manufacturing node. Based on Armv9-A ISA, the CPU will feature up to 150 cores with Scalable Vector Extensions 2 (SVE2), so it can process a wide variety of vector data sets in parallel. Using a 3D chiplet design, the 150 cores will be split into different dies and placed alongside SRAM and I/O controller. The current width of the SVE2 implementation is unknown.

The CPU is designed to support DDR5 memory and PCIe 6.0 connection for attaching storage and other accelerators. To bring cache coherency among application-specific accelerators, CXL 3.0 is present as well. Interestingly, Monaka is planned to arrive in FY2027, which starts in 2026 on January 1st. The CPU will supposedly use air cooling, meaning the design aims for power efficiency. Additionally, it is essential to note that Monaka is not a processor that will power the post-Fugaku supercomputer. The post-Fugaku supercomputer will use post-Monaka design, likely iterating on the design principles that Monaka uses and refining them for the launch of the post-Fugaku supercomputer scheduled for 2030. Below are the slides from Fujitsu's presentation, in Japenese, which highlight the design goals of the CPU.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

Micron Technology, Inc., today announced it has extended its industry-leading 1β (1-beta) process node technology with the introduction of 16Gb DDR5 memory. With demonstrated in-system functionality at speeds up to 7,200 MT/s, Micron's 1β DDR5 DRAM is now shipping to all data center and PC customers. Micron's 1β-based DDR5 memory with advanced high-k CMOS device technology, 4-phase clocking and clock-sync provides up to a 50% performance uplift and 33% improvement in performance per watt over the previous generation.

As CPU core counts increase to meet the demands of data center workloads, the need for higher memory bandwidth and capacities grows significantly to overcome the 'memory wall' challenge while optimizing the total cost of ownership for customers. Micron's 1β DDR5 DRAM allows computational capabilities to scale with higher performance enabling applications like artificial intelligence (AI) training and inference, generative AI, data analytics, and in-memory databases (IMDB) across data center and client platforms. The new 1β DDR5 DRAM product line offers current module densities in speeds ranging from 4,800 MT/s up to 7,200 MT/s for use in data center and client applications.

v-color Technology Inc, is thrilled to introduce a memory kit that redefines extreme performance. This release unveils an unparalleled DDR5 memory specification designed to push the boundaries of low-latency performance, with module capacity of 16GBx2 and 32GBx2 CL of 26 and speeds ranging from 5600 MHz up to 5800 MHz. These new kits will open a new era of gaming and overclocking, delivering speed and stability to the most demanding users

v-color announced its latest achievement in the form of an Ultra-Low-Timing XSky series DDR5 memory kit. This module operates at 32 GB (2x16GB) DDR5 5600 MHz CL26-36-36-76 1.4 V, 32 GB (2x 16 GB) DDR5 5800 MHz CL26-36-36-76 1.4 V and 64 GB (2x32GB) DDR5 5600 MHz CL26-36-36-76 1.4 V.

Leading memory provider, Team Group, has tapped into T-FORCE Lab's superb R&D capabilities to create the latest iteration of the T-FORCE XTREEM DDR5 memory. By utilizing a patented IC classification test and verification technology, the upper limits of the DDR5 frequency have been raised to create a high-clock rate memory module designed specifically for gamers. Decorated with the glorious T-FORCE logo badge, the XTREEM's design exudes both confidence and style, befitting the newest king of overclocking memory modules.

T-FORCE XTREEM DDR5 memory demonstrates incredible overclocking performance to satisfy overclocking enthusiasts around the world. Not only using 2 mm-thick aluminium alloy fin heatsinks to enhance its thermal capacity, but also uses special heat-conducting silicone to tightly adhere the heatsinks with the memory to achieve the most optimal cooling effect. The surface is also treated with an anodized surface that is resistant to acid, corrosion, rust and is non-electrically conductive, providing gamers with greater peace of mind. The T-FORCE XTREEM DDR5's two-piece heat spreader is made of thick metal and underwent sandblasted surface treatment to give it the appearance of hard basalt and the matte black texture reminiscent of a black sand beach. Users can enjoy the excellent overclocking capabilities of the XTREEM DDR5 while admiring its elegant design.

Today Acer has unveiled the Nitro V 15 gaming laptop—combining 13th Gen Intel Core processors, NVIDIA GeForce RTX 40 Series GPUs, up to 32 GB of DDR5 RAM, and support for up to 2 TB PCIe M.2 SSDs for smooth, worry-free gaming. Digital worlds seamlessly unfold when playing on the Acer Nitro V 15's vibrant Full HD display with a lightning-fast refresh rate of up to 165 Hz and paired with DTS X: Ultra's pinpoint sound accuracy. Thanks to the 15-inch gaming laptop's dual fan and exhaust system, the battle-ready internals are kept cool and let players dive deep into any gaming dimension without breaking a sweat.

Optimal Performance for Adrenaline-charged Gaming
The Acer Nitro V 15 is shipped with up to 13th Gen Intel Core i7 processors, designed with the latest hybrid architecture to deliver premium gaming, creating, video editing, and multi-tasking, even when on the go. Equipped with up to NVIDIA GeForce RTX 4050 Laptop GPUs, gamers are treated to lifelike virtual scenes as the device's GPU delivers power-efficient and AI-powered rendering capabilities with DLSS 3 and ray tracing.

Lenovo has unveiled the ThinkCentre M90a Pro Gen 4, setting a new standard for all-in-one (AIO) business desktop computers. Designed to address the needs of modern workplaces and content creators, this powerhouse Windows 11 PC wows with a massive 27-inch QHD display and is equipped with smart features that enhance connectivity, privacy, and usability.

"Modern businesses require more than just a high-performing PC, they need solutions that are smart and intuitive, reliable and efficient, and empowers them to create a multi-device ecosystem seamlessly," said Sanjeev Menon, vice president and general manager, Worldwide Desktop Business in Intelligent Devices Group, Lenovo. "In this evolving hybrid environment, employees use an average of 2.5 devices for work and would like to be provided with both desktops and laptops to allow them to be more productive. Lenovo's ThinkCentre M90a Pro Gen 4 is the answer for businesses looking for synergy and to make workspaces more flexible, streamlined, and productive."

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.

Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to unveil the brand-new H610MS and H610MHD D5 motherboards designed to supplement the needs of modern day professionals and home users seamlessly. Built based on Intel H610 single-chip architecture, ready for 12th and 13th Gen Intel Core Processors, these motherboards are ideal for the working professional, making tasks such as web browsing, emailing, and document management a breeze. For the home user, it delivers an unparalleled experience whether watching movies on Netflix, listening to music, gaming, or even for HTPC uses like streaming, live TV recording, and more.

The H610MS motherboard supports the robust DDR4 memory modules. Users can utilize 2 DIMM slots with a capacity of up to 64 GB. Meanwhile, the H610MHD D5 motherboard is designed to handle the latest DDR5 memory modules across a similar 2-DIMM configuration of up to 96 GB of Memory, ensuring users have a breadth of choices for their distinct build preferences. These motherboards are brimming with cutting-edge features tailored to modern computing demands. Each board seamlessly supports USB 3.2 Gen 1, ensuring rapid data transfers and connectivity. Additionally, they are primed for the future with support for both PCIe 4.0 and PCIe 3.0 interfaces, offering enhanced versatility for expansions. Furthermore, they are equipped to accommodate the blazing speeds of PCIe 3.0 M.2 drives with a bandwidth of 32 Gb/s, catering to users who seek swift storage solutions.

SK hynix announced on September 22 that it showcased its latest memory technologies and products at Intel Innovation 2023 held September 19-20 in the western U.S. city of San Jose, California. Hosted by Intel since 2019, Intel Innovation is an annual IT exhibition which brings together the technology company's customers and partners to share the latest developments in the industry. At this year's event held at the San Jose McEnery Convention Center, SK hynix showcased its advanced semiconductor memory products which are essential in the generative AI era under the slogan "Pioneer Tomorrow With the Best."

Products that garnered the most interest were HBM3, which supports the high-speed performance of AI accelerators, and DDR5 RDIMM, a DRAM module for servers with 1bnm process technology. As one of SK hynix's core technologies, HBM3 has established the company as a trailblazer in AI memory. SK hynix plans to further strengthen its position in the market by mass-producing HBM3E (Extended) from 2024. Meanwhile, DDR5 RDIMM with 1bnm, or the 5th generation of the 10 nm process technology, also offers outstanding performance. In addition to supporting unprecedented transfer speeds of more than 6,400 megabits per second (Mbps), this low-power product helps customers simultaneously reduce costs and improve ESG performance.

T-CREATE, the creator sub-brand of the global memory provider Team Group, today launched the T-CREATE MASTER DDR5 OC R-DIMM, an overclocking DDR5 ECC Registered DIMM memory. T-CREATE's MASTER series is designed specifically for workstations and servers. With its high specifications and large capacity, it fully satisfies the needs of professionals in handling large-scale projects, analyzing large data sets, and running multiple specialized applications concurrently. The T-CREATE MASTER DDR5 OC R-DIMM features a one-piece heat spreader with ventilation holes and thermally conductive silicone for quick heat dissipation. It also has on-die ECC, which allows systems to run more stably and provide excellent performance.

The T-CREATE MASTER memory module is an overclocking ECC Registered DIMM memory available in frequencies of 6000 MHz, 6400 MHz, and 6800 MHz. When the module is paired with workstation motherboards, memory capacity can reach up to a massive 384 GB, allowing professional creators to quickly complete all types of work and enjoy the creative flexibility that comes with large capacities. In addition to the on-die ECC that corrects bit errors within the DRAM chip, the MASTER memory also supports an ECC feature that corrects errors outside the chip and fixes data corruption, allowing for stable operation and greater peace of mind when creating. The MASTER R-DIMM is compatible with W790 series workstation motherboards and is made for creative professionals, developers, and engineers. When combined with the powerful computing of the latest Intel Xeon processors, the T-CREATE MASTER DDR5 OC R-DIMM memory delivers incredible performance and stability for content creation, graphic rendering, and the demanding applications of high-end workstations.

When Crucial cancelled its Ballistix gaming brand, it was unclear if the company would launch higher-end products in the future, although the company never said it wouldn't. Back in May of this year, Crucial launched its Pro series of memory, which was not exactly pro, at least not for the readership here which is used to an entirely different level of RAM. This was largely due to Crucial sticking to JEDEC spec, even though the company did launch some DDR5 5600 MHz modules.

Now—some six months later—it appears that Crucial is getting ready to deliver some higher performance modules with its new DDR5 6000 MHz modules, although at launch, they will only be available in a kit of two 24 GB modules. Although Crucial claims JEDEC spec, the 48-48-48 timings appear to either be slightly tighter than the original JEDEC spec, or JEDEC has updated the specs since they were announced. Although nothing about these modules screams high-end or pro, there's one thing that makes these stand out against the competition, they operate at 6000 MHz using only 1.1 Volt, whereas most 6000 MHz DIMMs on the market today, operate at 1.35 Volt higher. In addition to that, as these are JEDEC spec DIMMs, there's no need to enable XMP/EXPO settings to make them work at 6000 MHz, which could be a benefit to some. There might be some potential for tweaking these modules as well, something we'll have to wait for reviews to find out about. Crucial is asking for US$166.99 for the 48 GB kit, which puts them at a price disadvantage compared to its competitors, as you can get a similar kit for as little as $115 or possibly even less.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

AMD today rolled out the new compacted Socket SP6 server platform designed for smaller servers locally deployed at the edge by organizations. With CPU core-counts of up to 64-core/128-thread, these processors are based on the "Zen 4c" microarchitecture, which comes with identical IPC and ISA to "Zen 4," but with smaller L3 cache available per core. The EPYC 8004 series targets traditional data-centers located on-site for organizations. Even if the heavy-lifting of the IT for them is performed by remote data-centers or cloud providers, organizations still need smaller edge server deployments. The EPYC 8004 series caters to a different kind of servers than the ones the lower core-count models of EPYC 9004 "Genoa" do.

With the EPYC 8004 series, AMD is debuting a new smaller CPU socket called SP6. The socket measures 58.5 mm x 75.4 mm, compared to the 76.0 mm x 80.0 mm of Socket SP5 powering EPYC 9004 "Genoa" and EPYC 97x4 "Bergamo." Socket SP5 is an LGA with a pin count of 4,844, compared to SP5, which is LGA-6096. The first line of processors for this socket, the EPYC 8004 series, are codenamed "Siena." These are very much part of the 4th Gen EPYC series, a lineage it shares with "Genoa" for data-center servers, "Genoa-X" for compute servers, and "Bergamo" for high-density cloud.

The rumors of Nintendo's next-generation Switch handheld gaming console have been piling up ever since the competition in the handheld console market got more intense. Since the release of the original Switch, Valve has released Steam Deck, ASUS made ROG Ally, and others are also exploring the market. However, the next-generation Nintendo Switch 2 is closer and closer, as we have information about the chipset that will power this device. Thanks to Kepler_L2 on Twitter/X, we have the codenames of the upcoming processors. The first generation Switch came with NVIDIA's Tegra X1 SoC built on a 20 nm node. However, later on, NVIDIA supplied Nintendo with a Tegra X1+ SoC made on a 16 nm node. There were no performance increases recorded, just improved power efficiency. Both of them used four Cortex-A57 and four Cortex-A53 cores with GM20B Maxwell GPUs.

For the Nintendo Switch 2, NVIDIA is said to utilize a customized variant of NVIDIA Jetson Orin SoC for automotive applications. The reference Orin SoC carries a codename T234, while this alleged adaptation has a T239 codename; the version is most likely optimized for power efficiency. The reference Orin design is a considerable uplift compared to the Tegra X1, as it boasts 12 Cortex-A78AE cores and LPDDR5 memory, along with Ampere GPU microarchitecture. Built on Samsung's 8 nm node, the efficiency would likely yield better battery life and position the second-generation Switch well among the now extended handheld gaming console market. However, including Ampere architecture would also bring technologies like DLSS, which would benefit the low-power SoC.

Patriot Memory has announced a full expansion of its latest DDR5 performance memory series, the Viper Xtreme 5 DDR5. This expansion will include new non-RGB models available in 7,600 MT/s and 8,200 MT/s kits, with kit capacities from 32 GB (16 GB x2) to 48 GB (24 GB x2). Previously unveiled at CES 2023, the Viper Xtreme 5 aims to take system performance to a new level with performance memory built for extreme overclockers, serious gamers and enthusiast tinkerers alike. With speeds reaching up to 8,200 MT/s, the Viper Xtreme 5 is Patriot Memory and Viper Gaming's fastest DRAM produced to date.

Since its debut, the Viper Xtreme 5 has received strong praise from gamers, tech enthusiasts and media alike, including a nomination for "Best System Memory Series" at the 2023 European Hardware Awards, FunkyKit Editor's Choice Award, Techpowerup Editor's Choice Award, TweakTown Editor's Choice Award and Overclockers.com's "Approved" Top Rating. The Viper Xtreme 5 was also featured in multiple record-breaking overclock competitions by overclockers Chewonthis and Fugger.

In a recent interaction with the community on Chinese social platforms, Tony Yu, better known as Uncle Tony and serving as the General Manager of ASUS China, shed light on several questions concerning ASUS's products. One question that captured attention was about the ROG Z790 APEX motherboard, a premium offering from ASUS designed explicitly for overclocking. Tony clarified that the motherboard is currently out of production as ASUS gears up to unveil an updated version. This move is in line with industry trends, with rivals like Gigabyte and MSI also refreshing their respective Z790 lineups. The updated motherboards from ASUS are expected to align with Intel's next-generation Core series known as Raptor Lake Refresh, featuring incremental improvements such as WiFi-7 standard integration, new color options, enhanced power delivery mechanisms, and advancements in memory overclocking capabilities.

Launched initially in November of the previous year with a price tag of $699, the ROG MAXIMUS Z790 APEX motherboard stood out for its superior features aimed at overclocking enthusiasts. These include 24 power supply modules, dual 8Pin power connectors, AI-driven overclocking technology, and support for DDR5 memory with speeds exceeding 8000 MT/s. It also offers a plethora of connectivity options, like five M.2 interfaces, a 2.5G network card, WiFi 6E, and USB 3.2 Gen 2x2 Type-C, along with 60 W QC 4+ fast charging. This motherboard gained popularity in December when it was used to set a world record CPU frequency of 9008.82 MHz using an Intel i9-13900K processor. Looking forward, the next generation of Intel Core processors could enable even higher overclocking frequencies. Apart from this, Tony tantalizingly hinted that ASUS is experimenting with innovative design changes, such as introducing connectors on the reverse side of motherboards, although this feature may not debut in the APEX series.

In order to meet the evolving needs of Netcom data center computing, global memory provider TEAMGROUP is proud to introduce the new DDR5 VLP ECC U-DIMM normal and wide temperature (-40° to +85°C) memory module. It features DDR5 high performance, high frequencies, and large-capacity industrial ICs. Designed to have an extremely low profile for greater performance and more compact hardware configurations, the U-DIMM provides users with better performance and reliability than ever before.

Team Group's DDR5 VLP ECC U-DIMM memory modules come in frequencies up to 4800 MHz and 5600 MHz to ensure fast data processing and enhance computing performance. The memory is also offered in a wide range of capacity options, from 16 GB to 48 GB, allowing users to select the most suitable capacity kit for their platform's workload and computing needs. This module comes in an ultra-low-profile design, with a board height of only 0.738 inches, half of the normal modules. This allows it to meet the hardware configuration requirements of blade servers and helps maximize space for the user's configuration of components, and achieves higher server density.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly unveils its latest creations: the Z790 AORUS PRO X and the B760M AORUS ELITE X AX. These masterpieces are meticulously engineered to not only unleash the full potential of the next-gen Intel processors but also support mind-bending DDR5-8266 and beyond.

Prepare to be captivated by the alluring all-white aesthetics of these motherboards. The PCB boards boast the latest color-matched solder mask, accompanied by entrancing lighting effects. The new UC BIOS also provides the white version which is redesigned as user-centered and offers an intuitive operation interface with an aesthetically pleasing design. Moreover, Quick Access function and nine customizable option slots for effortless access in Easy Mode are also at your fingertips. Paired with the sleek white antenna, assembling the most immersive, visually striking white-themed rig on the market has never been this effortless.

ADATA Technology Co., Ltd., the world's leading memory brand, announced a theme of "Dazzling Tomorrow" for its annual creator event " You Are a Rising Star," held from today until October 13th. Use creative techniques such as graphic design, 3D rendering, and video to weave your own moving story. Share your pieces publically on Instagram and you will have an opportunity to win excellent prizes valued at more than USD$5,700.

With the generational change of processors and chipsets, DDR5 memory entering the mainstream, the rapid rise of Gen 4 SSDs and a migration to the Gen 5 era, coupled with the rise of generative AI tools, creator software and hardware must also improve in leaps and bounds. ADATA's online creator contest officially enters its fourth year and continues to provide a platform for talent in the fields of "graphic design," "video creation," "animation," and "photography" to unleash their creativity. This year, we continue our commitment to the spirit of "Build to Create" to produce better solutions for content creators, including major international award winning high-end and comprehensive products such as the LEGEND 970 Gen 5 SSD, ACE series memory module, SE920 USB4 external SSD, and other devices to inspire creativity.